Thermaltake TG-30 Premium CPU/GPU Heatsink Thermal Compound | 4g | CL-O023-GROSGM-A
Availability: In Stock
About this product
*[Performance Compound] Contains diamond powder for higher heat transfer providing a thermal conductivity of 4.5 W/m-k.
*[All-In-One Application Kit] Includes tools to clean, prep, and install fresh thermal compound to your hardware.
*[Easy to Apply] Specially formulated to easily spread over the included honeycomb stencil for consistent compound application, providing a neat and well-covered CPU.
*[Sustainability and Safety] The TG-30 is a non-electrically conductive compound eliminating risk of short circuit and offers a longer lifespan minimizing dry-out or cracking
Description
Designed to lower CPU temperatures effectively, TG-30 is a premium thermal compound which contains diamond powder to improve thermal conductivity to maximize heat transfer, providing a longer lifespan eliminating dry-out or cracking while in use. This thermal compound application kit includes a set of easily-applied tools for immediate use. On top of that, the TG-30’s honeycomb stencil can help users to apply thermal compound for a neat and well-covered surface which fits all CPUs.P/N: CL-O023-GROSGM-ATHERMAL CONDUCTIVITY: 4.5 W/m-kCOLOR: GrayWEIGHT: 4gVISCOSITY: 76 Pa-sTHERMAL IMPEDANCE: 0.185°C -in /WDENSITY: 2.55 g/cm
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