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Solder paste for phone repair, suitable for PCB & BGA rework. High tin speed, low smoke, and excellent insulation.

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Flux Paste Solder Paste Tin No‑Clean for Phone Repair Soldering Solder Tin Cream 559 NC‑559‑ASM 28um
Flux Paste Solder Paste Tin No‑Clean for Phone Repair Soldering Solder Tin Cream 559 NC‑559‑ASM 28um
Feature:1. Used in mobile phone PCB, BGA and PGA SMD rework solder paste and low ion system2. High t..
US$7.69
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